Extreme Ultraviolet (EUV) lithography represents a significant leap forward in semiconductor manufacturing. By using a 13.5 nm wavelength light source, EUV enables the production of smaller, denser, and more power-efficient transistors, which are essential for keeping pace with Moore’s Law.
Compared to conventional Deep Ultraviolet (DUV) methods, EUV allows for reduced reliance on complex multi-patterning techniques, streamlining the fabrication process and improving yield and throughput. These advantages make EUV suitable for producing leading-edge chips at nodes of 7nm and below, powering everything from advanced AI processors to energy-efficient mobile devices.
Future advancements in EUV could significantly expand its impact. Next-generation developments such as high numerical aperture (NA) EUV promise even finer pattern resolution, enabling sub-3nm nodes and possibly extending the scalability of silicon-based technologies for years to come. Combined with ongoing improvements in energy efficiency, pellicle durability, and mask alignment precision, EUV may also open doors to hybrid integration methods and further innovations in chiplet architecture, 3D packaging, and heterogeneous computing. As these technological frontiers are explored, EUV will continue to be a foundational enabler for future computing platforms.
As EUV lithography scales to meet the demands of ever-smaller nodes, its substantial energy requirements – estimated at around 1,400 kW per system – are emerging as a central challenge. These high-power demands place increasing strain on semiconductor fabs, particularly in regions with limited access to clean or reliable energy. As more fabs adopt EUV for advanced-node production, the cumulative environmental and operational impact is expected to grow, prompting increased regulatory scrutiny and public pressure for greener manufacturing practices. While alternative technologies, such as nanoimprint or direct-write lithography, are being explored, they remain limited by scalability and similarly intensive power requirements, reinforcing EUV’s position as the most viable path forward, provided its efficiency can be improved.
At the same time, geopolitical tensions and shifting trade policies, such as U.S.–China tariff dynamics, are reshaping global supply chains. In response, many semiconductor firms are expanding into more politically stable and regulation-friendly environments, including Vietnam, Malaysia, and India. These moves are not only about risk mitigation, but also about aligning with jurisdictions that support sustainability mandates and energy-efficient innovation. As a result, energy performance is no longer just a technical consideration; it has become a strategic lever in global competitiveness.
Given the maturity of foundational EUV technologies, much of the core intellectual property related to light sources, optics, resists, and photomasks has already been patented or licensed by early leaders, such as ASML and its ecosystem partners. As a result, the patent landscape is shifting from foundational claims to incremental improvements and application-specific innovations, such as energy-saving techniques, process integration for advanced node compatibility, and the optimization of hybrid EUV/DUV workflows.
Companies aiming to stay competitive must increasingly focus their IP strategies on practical advancements, energy efficiency, manufacturability, and region-specific deployment methods, particularly in emerging manufacturing hubs with unique regulatory and infrastructure challenges. While the EUV patent space is more saturated than it was a decade ago, the next wave of value will likely stem from process tuning, sustainability, and deployment scalability.
In this evolving landscape, the strategic value of EUV-related patents is shifting from core technology ownership to differentiated, application-driven innovation. As foundational IP becomes increasingly consolidated, future competitive advantage will lie in securing patents that address efficiency, scalability, and localized manufacturing constraints. Companies that proactively align their IP portfolios with energy-saving process improvements and jurisdiction-specific manufacturing realities, particularly in emerging markets, will be best positioned to navigate rising regulatory demands and geopolitical uncertainty. In the context of EUV, intellectual property is no longer just about protecting breakthroughs; it is a tool for enabling resilient, regionally adaptive, and sustainable semiconductor production.
DISCLAIMER: The information contained in this article is for informational purposes only and is not legal advice or a substitute for obtaining legal advice from an attorney. Views expressed are those of the author and are not to be attributed to Marshall, Gerstein & Borun LLP or any of its former, present, or future clients.